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We were impressed...

on how quickly the design community was able to pick up and learn the GreenPAK technology as well as the quality of the designs that resulted from of the challenge.

John Teegen

VP and GM Configurable Mixed-signal IC Business Unit, Dialog Semiconductor, Inc.

When our company was transitioning circuit technology from a university environment, we needed to find a cost-effective tool chain and path to fabrication for our first devices. Efabless was unbeatable. Using the Efabless platform a small team was able to collaborate in the design, verification, and tape-out of an IC on an XFABS MPW shuttle at dramatically lower cost. The support received from Efabless was exceptional throughout.

Tom Darbonne

CEO. Ergense

Customers & Partners

Featured Articles

03.05.2018
RISC-V Based Microcontroller

ASIC implementation of the PicoRV32 PicoSoC in X-Fab XH018. It contains two ADCs, a DAC, comparator, bandgap, RC oscillator and other IP.

01.05.2018
Efabless & Arm Enable Fast Affordable Custom SoC Development

We are now in an exciting time where the realization of custom SoCs is cost-effective and affordable for small companies or low-volume projects.

03.03.2018
Webinar: How to design a RISC-V SoC

Making the Raven chip. Brought to you by efabless and VLSI System Design.

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