I received the B.S. degree in Industrial Electronics Engineering from the Universitat Politècnica de Catalunya, Spain, in 2007, and the M.S. degree in Micro- and Nanoelectronics Engineering in 2009 and the Ph.D. degree in Microelectronics and Electronic Systems in 2015 both from the Universitat Autònoma de Barcelona, Spain. From 2006 to 2008, I was with Investigation Total Ware, S.A., Spain, where I was engaged in analog and mixed-signal circuit design for highly reliable wireless telecommunication systems. From 2008 to 2015, I was with the Integrated Circuits and Systems design group at the Institut de Microelectrònica de Barcelona, CNM, CSIC, Spain, designing low-power high-precision mixed-signal ASICs for integrated smart sensors and IP blocks. From 2015 to 2016, I was with Broadcom Ltd., Barcelona, Spain, developing low-power CMOS IPs like low-temperature-drift oscillators, varible-temperature-coefficient current/voltage generators, temperature sensors, cross-domain level shifting and biasing circuits, touch-sensor transmitter drivers. I am co-author of 12 publications and participant in several research and industrial projects using a wide range of CMOS technology nodes. I am recipient of the 2007 Highest Grade Point Average in the Graduating Class Award, the 2014 Best Paper Award and the 2015 Student Best Paper Award Honorable Mention. My skills include: high-performance continuous-time/switched-capacitor circuits such as low-power high-resolution ADCs/DACs using Class-AB OpAmps; system high-level modeling (SciPy/Sage, Matlab); system electrical-level modeling (Verilog/-A/-AMS); EKV circuit-level modeling; full-custom IC design cycle (gEDA Tools/Cadence Virtuoso: from schematics to layout and verification); development of low-noise and low-distortion test equipment (including microcontrollers and FPGAs) and software (using C++, Tcl, VB, Python); and, experimental IC measures and parameter extraction.
High Performance, High Frequency Analog, Microwave, RF and Optical Chip and Package Test Software and Hardware, Multi-Chip System Integration and Reliability