The Efabless chipIgnite Shuttle Program provides fabrication for open or propriatery projects using the SkyWater Open Source PDK announced by Google and SkyWater.
MULTI-PROJECT WAFER PROGRAM TERMS
Thank you for your interest in Efabless Corporation, a Delaware Corporation having its principal place of business at 2570 N 1st St, Suite 200, San Jose, California 95131 (“efabless”, “we”, or “us”), and our multi-project wafer program (the “Program”), pursuant to which you, an individual and independent semiconductor circuit designer or an authorized individual acting on behalf of a corporate entity that desires to participate in the Program (“you” or “Customer”) may submit your designs based on our Caravel design (your “Design”) for inclusion on a multi-project wafer (an “MPW”), and receive certain Deliverables. These Multi-Project Wafer Program Terms (the “Agreement”), govern your participation in the Program.
By clicking “I ACCEPT,” submitting a or otherwise participating in the Program, you are acknowledging that you have read, understand and agree to accept and be bound by the terms and conditions of this Agreement. If you do not agree, you may not participate in the Program. If you are entering into this Agreement on behalf of a company, business or other legal entity, you represent that you have the authority to bind such entity to the terms of this Agreement, in which case "you" or “Customer” shall refer to such entity, and to each individual user (including you) participating in the Program on such entity’s behalf. The effective date of this Agreement (“Effective Date”) is the date that you accept or agree to this Agreement by clicking “I ACCEPT,” or otherwise accessing, or using the Services. Use of our website and related services is subject to our Terms of Service (available online at https://efabless.com/terms_of_service, and which are incorporated by reference herein).
The following requirements must be met in order to qualify for inclusion in the Program:
CHIPIGNITE SHUTTLE SERVICE
chipIgnite chip tapeout service
chipIgnite fabrication, packaging and PCBA assembly